JPH0453024Y2 - - Google Patents
Info
- Publication number
- JPH0453024Y2 JPH0453024Y2 JP18471787U JP18471787U JPH0453024Y2 JP H0453024 Y2 JPH0453024 Y2 JP H0453024Y2 JP 18471787 U JP18471787 U JP 18471787U JP 18471787 U JP18471787 U JP 18471787U JP H0453024 Y2 JPH0453024 Y2 JP H0453024Y2
- Authority
- JP
- Japan
- Prior art keywords
- terminal
- plating
- parts
- wiring
- circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000007747 plating Methods 0.000 claims description 20
- 238000005520 cutting process Methods 0.000 claims description 11
- 239000000758 substrate Substances 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- 101700004678 SLIT3 Proteins 0.000 description 1
- 102100027339 Slit homolog 3 protein Human genes 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18471787U JPH0453024Y2 (en]) | 1987-12-02 | 1987-12-02 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18471787U JPH0453024Y2 (en]) | 1987-12-02 | 1987-12-02 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0187579U JPH0187579U (en]) | 1989-06-09 |
| JPH0453024Y2 true JPH0453024Y2 (en]) | 1992-12-14 |
Family
ID=31476058
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18471787U Expired JPH0453024Y2 (en]) | 1987-12-02 | 1987-12-02 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0453024Y2 (en]) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007012886A (ja) * | 2005-06-30 | 2007-01-18 | Sumitomo Electric Ind Ltd | プリント配線板の製造方法 |
| JP2010232579A (ja) * | 2009-03-30 | 2010-10-14 | Oki Networks Co Ltd | プリント配線板の製造方法 |
-
1987
- 1987-12-02 JP JP18471787U patent/JPH0453024Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0187579U (en]) | 1989-06-09 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| DE102008061068A1 (de) | Elektronikbauelement | |
| JPH0453024Y2 (en]) | ||
| JPH0249742Y2 (en]) | ||
| JP2526566Y2 (ja) | 半導体装置の実装基板 | |
| JPS58178544A (ja) | リ−ドフレ−ム | |
| JPS5840614Y2 (ja) | 半導体装置 | |
| JP2737204B2 (ja) | プリント基板 | |
| JP2882085B2 (ja) | フィルムキャリア回路基板及びその製造方法 | |
| JPS60263492A (ja) | プリント基板の製造方法 | |
| JPS6230397A (ja) | 印刷配線板の製造方法 | |
| JPH087649Y2 (ja) | プリント配線板 | |
| JPH0223004Y2 (en]) | ||
| JPS5935007Y2 (ja) | 回路基板 | |
| JPS58300Y2 (ja) | プリント板 | |
| JPS6038291Y2 (ja) | チツプ搭載用のプリント配線板 | |
| JPS6397235U (en]) | ||
| JPS62222644A (ja) | テ−プキヤリヤ | |
| JPS6365699A (ja) | 多層印刷配線板およびその製造方法 | |
| JPH0488664A (ja) | 絶縁基材を有するリードフレーム | |
| JPH04152594A (ja) | プリント配線板の製造方法 | |
| JPS63112347U (en]) | ||
| JPH032665U (en]) | ||
| JPH10270593A (ja) | 半導体パッケージの製造方法 | |
| JPH11251701A (ja) | プリント配線基板 | |
| JPS5895891A (ja) | 回路配線基板の製造方法 |